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DS14C535 www.ti.com snls092c ? may 1998 ? revised april 2013 DS14C535 +5v supply eia/tia-232 3 x 5 driver/receiver check for samples: DS14C535 1 features description the DS14C535 is three driver, five receiver device 2 ? pin compatible with ds14c335 which conforms to eia/tia-232-e and ccitt (itu-t) ? conforms to eia/tia-232-e and ccitt (itu-t) v.28 standard specifications. this device employs an v.28 specifications internal dc-dc converter to generate the necessary ? failsafe receiver outputs high when inputs output levels from a +5v power supply. a shutdown (sd) mode reduces the supply current open to 10 a maximum. in the sd mode, one receiver is ? operates with single +5v power supply active, allowing ring indicator (ri) to be monitored. ? low power requirement ? i cc 12 ma maximum pc board space consumption is minimized by the ? shutdown mode ? i cx 10 a maximum availability of shrink small outline packaging (ssop). ? one receiver (r5) active during shutdown the DS14C535 provides a one-chip solution for the ? operates up to 128 kbps ? lap-link common 9-pin serial rs-232 interface between data compatible terminal and data circuit-terminating equipment. ? 4v/ s minimum slew rate ensured this device allows an easy migration path to the 3.3v ? esd rating of 3 kv on all pins (h, b, m) ds14c335. the packages are the same. the n/c ? available in 28-lead ssop eiaj type ii pins on the DS14C535 are not physically connected package to the chip. board layout for the ds14c335 will ? only four 0.1 f capacitors required for the accommodate both devices. dc-dc converter this device's low power requirement and small footprint makes it an ideal choice for laptop and notebook applications. connection diagram top view figure 1. 28-lead ssop see db package 1 please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2 all trademarks are the property of their respective owners. production data information is current as of publication date. copyright ? 1998 ? 2013, texas instruments incorporated products conform to specifications per the terms of the texas instruments standard warranty. production processing does not necessarily include testing of all parameters.
DS14C535 snls092c ? may 1998 ? revised april 2013 www.ti.com functional diagram figure 2. these devices have limited built-in esd protection. the leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the mos gates. 2 submit documentation feedback copyright ? 1998 ? 2013, texas instruments incorporated product folder links: DS14C535
DS14C535 www.ti.com snls092c ? may 1998 ? revised april 2013 absolute maximum ratings (1) (2) supply voltage (v cc ) ? 0.3v to +6v v + pin (v cc ? 0.3v) to +14v v ? pin +0.3v to ? 14v input voltage (d in , sd) ? 0.3v to +5.5v driver output voltage (v + +0.3v) to (v ? ? 0.3v) receiver input voltage 25v receiver output voltage ? 0.3v to (v cc +0.3v) junction temperature +150 c storage temperature range ? 65 c to +150 c lead temperature (soldering 4 sec.) +260 c short circuit duration (d out ) continuous maximum package power dissipation @ +25 c ssop db package 1286 mw derate db package 10.3 mw/ c above +25 c esd rating (hbm, 1.5 k , 100 pf) 3.0 kv (1) ? absolute maximum ratings ? are those values beyond which the safety of the device cannot be specified. they are not meant to imply that the devices should be operated at these limits. the tables of ? electrical characteristics ? specify conditions for device operation. (2) if military/aerospace specified devices are required, please contact the texas instruments sales office/ distributors for availability and specifications. recommended operating conditions min max units supply voltage (v cc ) 4.5 5.5 v operating free air temperature (t a ) DS14C535 0 +70 c electrical characteristics (1) (2) over recommended operating conditions, sd = 0.8v, unless otherwise specified. symbol parameter conditions min typ max units device characteristics v + positive power supply no load d in = 0.8v +8.5 v v ? negative power supply c1 ? c4 = 0.1 f d in = 2.0v ? 7.0 v i cc supply current no load 12 ma i cx shutdown supply current r l = 3 k , sd = v cc 1.0 10 a v ih high level enable voltage sd 2.0 v v il low level enable voltage gnd 0.8 v i ih high level enable current 2.0v v in 5.5v +2.0 a i il low level enable current gnd v in 0.8v ? 2.0 a driver characteristics v ih high level input voltage d in 2.0 v v il low level input voltage gnd 0.8 v i ih high level input current 2.0v v in 5.5v +1.0 a i il low level input current gnd v in 0.8v ? 1.0 a v oh high level output voltage r l = 3 k +5.0 8 v v ol low level output voltage ? 6.7 ? 5.0 v i os+ output high short circuit current v o = 0v, v in = 0.8v (3) ? 40 ? 20 ? 8 ma (1) typical values are given for v cc = 5v and t a = +25 c. (2) current into device pins is defined as positive. current out of device pins is defined as negative. all voltages are referenced to ground unless otherwise specified. for voltage logic levels, the more positive value is designated as maximum. for example, if ? 5v is a maximum, the typical value ( ? 6.7v) is more negative. (3) only one driver output shorted at a time. copyright ? 1998 ? 2013, texas instruments incorporated submit documentation feedback 3 product folder links: DS14C535
DS14C535 snls092c ? may 1998 ? revised april 2013 www.ti.com electrical characteristics (1) (2) (continued) over recommended operating conditions, sd = 0.8v, unless otherwise specified. symbol parameter conditions min typ max units i os ? output low short circuit current v o = 0v, v in = 2.0v (3) 6 15 40 ma r o output resistance ? 2v v o +2v, v cc = gnd = 0v 300 1200 receiver characteristics (4) v th input high threshold voltage r1 ? r5, sd = 0.8v (active mode) 1.4 2.4 v r5, 2.0v sd 5.5v (shutdown mode) 2.0 2.8 v v tl input low threshold voltage r1 ? r5, sd = 0.8v (active mode) 0.8 1.1 v r5, 2.0v sd 5.5v (shutdown mode) 0.8 1.1 v v hy hysteresis (4) 0.15 1.0 v r in input resistance v in = 3v to 15v 3.0 5.4 7.0 k i in input current v in = +15v 2.14 5.0 ma v in = +3v 0.43 1.0 ma v in = ? 3v ? 1.0 ? 0.43 ma v in = ? 15v ? 5.0 ? 2.14 ma v oh high level output voltage v in = ? 3v, i oh = ? 2.0 ma 3.8 v v in = ? 3v, i oh = ? 20 a 4.0 v v ol low level output voltage v in = +3v, i ol = +2.0 ma 0.23 0.4 v (4) receiver characteristics are ensured for sd = 0.8v. when sd = 2.0v, receiver five (r5) is active and meets receiver parameters in shutdown (sd) mode, unless otherwise specified. switching characteristics (1) over recommended operating conditions, sd = 0.8v, unless otherwise specified. symbol parameter conditions min typ max units driver characteristics t plh propagation delay low to high r l = 3 k 0.1 0.6 1.0 s c l = 50 pf t phl propagation delay high to low 0.1 0.6 1.0 s (see figure 3 and figure 4 ) t sk skew |t plh ? t phl | 0 0.2 s sr1 output slew rate r l = 3 k to 7 k , c l = 50 pf (see figure 4 ) 4 13 30 v/ s sr2 output slew rate r l = 3 k , c l = 2500 pf (see figure 4 ) 4 10 30 v/ s t pls propagation delay low to sd (see figure 7 and figure 8 ) 0.48 ms t psl propagation delay sd to low 1.88 ms r l = 3 k t phs propagation delay high to sd 0.62 ms c l = 50 pf t psh propagation delay sd to high 1.03 ms receiver characteristics t plh propagation delay low to high c l = 50 pf (see figure 5 and figure 6 ) 0.1 0.4 1.0 s t phl propagation delay high to low 0.1 0.6 1.0 s t sk skew |t plh ? t phl | 0.1 0.5 s t pls propagation delay low to sd 0.13 s r l = 1 k t psl propagation delay sd to low 1.0 s c l = 50 pf r1 ? r4 only t phs propagation delay high to sd 0.19 s (see figure 9 and figure 10 ) t psh propagation delay sd to high 0.58 s (1) receiver characteristics are ensured for sd = 0.8v. when sd = 2.0v, receiver five (r5) is active and meets receiver parameters in shutdown (sd) mode, unless otherwise specified. 4 submit documentation feedback copyright ? 1998 ? 2013, texas instruments incorporated product folder links: DS14C535
DS14C535 www.ti.com snls092c ? may 1998 ? revised april 2013 parameter measurement information figure 3. driver propagation delay and slew rate test circuit figure 4. driver propagation delay and slew rate timing figure 5. receiver propagation delay test circuit figure 6. receiver propagation delay timing figure 7. driver shutdown (sd) delay test circuit figure 8. driver shutdown (sd) delay timing copyright ? 1998 ? 2013, texas instruments incorporated submit documentation feedback 5 product folder links: DS14C535
DS14C535 snls092c ? may 1998 ? revised april 2013 www.ti.com figure 9. receiver shutdown (sd) delay test circuit figure 10. receiver shutdown (sd) delay timing pin descriptions v cc (pin 3). power supply pin for the device, +5v ( 0.5v). v+ (pin 1). positive supply for eia/tia-232-e drivers. recommended external capacitor ? 0.1 f (16v). this supply is not intended to be loaded externally. v ? (pin 25). negative supply for eia/tia-232-e drivers. recommended external capacitor ? 0.1 f (16v). this supply is not intended to be loaded externally. c1+, c1 ? (pins 2, 4). external capacitor connection pins. c2+, c2 ? (pins 28, 26). external capacitor connection pins. shutdown (sd) (pin 23). a high on the shutdown pin will lower the total i cc current to less than 10 a, providing a low power state. in this mode receiver r5 remains active. the sd pin should be driven or tied low (gnd) to disable the shutdown mode. d in 1 ? 3 (pins 7, 8, 9). driver input pins. d out 1 ? 3 (pins 22, 21, 20). driver output pins conform to eia/tla-232 -e levels. r in 1 ? 5 (pins 19, 18, 17, 16, 15). receiver input pins accept eia/tia-232-e input voltages ( 25v). receivers ensures hysteresis of tbd mv. unused receiver input pins may be left open. internal input resistor (5 k ) pulls input low, providing a failsafe high output. r out 1 ? 5 (pins 10, 11, 12, 13, 14). receiver output pins. gnd (pins 5, 27). ground pins. both pins must be connected to external ground. these pins are not connected together on the chip. 6 submit documentation feedback copyright ? 1998 ? 2013, texas instruments incorporated product folder links: DS14C535
DS14C535 www.ti.com snls092c ? may 1998 ? revised april 2013 application information in a typical data terminal equipment (dte) to data circuit-terminating equipment (dce) 9-pin de-facto interface implementation, 2 data lines and 6 control lines are required. the data lines are txd and rxd and the control lines are rts, dtr, dsr, dcd, cts and ri. the DS14C535 is a 3 x 5 driver/receiver and offers a single chip solution for the dte interface as shown in figure 11 . ring indicator (ri) is used to inform the dte that an incoming call is coming from a remote dce. when the DS14C535 is in shutdown (sd) mode, receiver five (r5) remains active and monitors ri circuit. this active receiver (r5) alerts the dte to switch the DS14C535 from shutdown to active mode. to achieve minimum power consumption, the DS14C535 can be in shutdown mode and only activated when communications are needed. figure 11. typical dte application capacitors capacitors can be ceramic or tantalum. standard surface mount in the range of 0.1 f to 0.68 f are readily available from several manufacturers. a minimum 20v rating is recommended. contact manufacturers for specific detail on surface mounting and dielectrics. a partial list of manufacturers include: manufacturer phone number kemet 803-963-6300 avx 803-448-9411 murata-erie 800-831-9172 copyright ? 1998 ? 2013, texas instruments incorporated submit documentation feedback 7 product folder links: DS14C535
DS14C535 snls092c ? may 1998 ? revised april 2013 www.ti.com revision history changes from revision b (april 2013) to revision c page ? changed layout of national data sheet to ti format ............................................................................................................ 7 8 submit documentation feedback copyright ? 1998 ? 2013, texas instruments incorporated product folder links: DS14C535
package option addendum www.ti.com 16-oct-2015 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples DS14C535msa/nopb lifebuy ssop db 28 47 green (rohs & no sb/br) cu sn level-3-260c-168 hr 0 to 70 DS14C535 msa DS14C535msax/nopb lifebuy ssop db 28 2000 green (rohs & no sb/br) cu sn level-3-260c-168 hr 0 to 70 DS14C535 msa (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release.
package option addendum www.ti.com 16-oct-2015 addendum-page 2 in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant DS14C535msax/nopb ssop db 28 2000 330.0 16.4 8.4 10.7 2.4 12.0 16.0 q1 package materials information www.ti.com 23-sep-2013 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) DS14C535msax/nopb ssop db 28 2000 367.0 367.0 38.0 package materials information www.ti.com 23-sep-2013 pack materials-page 2
mechanical data msso002e ? january 1995 ? revised december 2001 post office box 655303 ? dallas, texas 75265 db (r-pdso-g**) plastic small-outline 4040065 /e 12/01 28 pins shown gage plane 8,20 7,40 0,55 0,95 0,25 38 12,90 12,30 28 10,50 24 8,50 seating plane 9,90 7,90 30 10,50 9,90 0,38 5,60 5,00 15 0,22 14 a 28 1 20 16 6,50 6,50 14 0,05 min 5,90 5,90 dim a max a min pins ** 2,00 max 6,90 7,50 0,65 m 0,15 0 ? 8 0,10 0,09 0,25 notes: a. all linear dimensions are in millimeters. b. this drawing is subject to change without notice. c. body dimensions do not include mold flash or protrusion not to exceed 0,15. d. falls within jedec mo-150
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